Chip card, and method for the production thereof

ABSTRACT

A chip card in the form of an ID-1 card, a plug-in SIM or a USB token comprises a layered compound ( 12 ) with two ( 4, 5 ) or three ( 4, 5, 9 ) layers extending over the complete chip card ( 1 ). Therein an exterior foil layer ( 4 ) has on its outward facing front side ( 4   a ) a communication contact layout ( 2 ) and on its back side ( 4   b ) a flip chip ( 7 ), as well as a flip chip contact layout ( 6 ) which is electroconductively connected with the communication contact layout ( 2 ) on the front side.

BACKGROUND

A. Field

The invention relates to a method for producing chip cards in the formof plug-in SIMs or as standardized smart cards, in particular in theID-1 format. The cards can also be dual interface cards or also cardswith other form factors, such as for example in the form of a USB tokenwith corresponding USB contact connectors.

B. Related Art

The production of chip cards is subject to particular cost demands. Inthis technical field therefore particular efforts are being made tolower the production costs. Usually chip modules are inserted inprefabricated chip card bodies, typically adhesively bonded into a gapprovided in the card body for this purpose. The production of the chipmodules and the production of the card bodies correspondingly areseparate processes. The card bodies are produced predominantly inlaminating technique as sheets or rolls, and the chip modules areinserted in the card bodies before or after the punching out of the cardbodies from the foil compound.

The chip modules are usually made available on a foil substrate in theform of a carrier band and punched out of the carrier band when they areinserted in the card body, so that a part of the carrier band is alsotransferred. On the front side of the carrier band there are disposedISO contact areas for contact-type communication with externalcommunication devices, and on the back side of the carrier band thereare disposed the chip and contact areas for the chip, via which the chipis connected electroconductively with the contact areas on the frontside of the carrier band. Recently the chip is mounted on the contactareas on the back in flip-chip technology. Thereby the elaborate wirebonding can be done without, and also a molding in of the chip and ofthe sensitive wires with epoxy resin or the like can be omittedoptionally.

BRIEF SUMMARY OF THE DISCLOSURE

It is the object of the present invention to further reduce theproduction costs of such chip cards.

Correspondingly it is provided to bond the foil substrate, which on thefront side is equipped with several contact layouts for the contact-typecommunication and on the back side with several contact layouts and flipchips mounted or to be mounted thereon, together with at least onereinforcement layer, to form a layered compound or material, from whichthe individual chip cards with the final chip card dimensions then aresevered.

Thus instead of punching out chip modules from the foil substrate orcarrier band and inserting them in chip card bodies, the complete foilsubstrate with the chip modules build thereon become part of the layeredcompound or material in total, so that an essential production step canbe economized. Correspondingly the foil substrate carrying the flipchips has a width and/or a length which corresponds to a multiple of thewidth or length of the chip cards to be produced therefrom. Preferablythe foil substrate—and, in case the reinforcement layer is present inthe form of a foil, also the reinforcement foil—is made available assheet good or roll good.

The contact areas at least on the front side and preferably also on theback side of the foil substrate are advantageously realized as ametallization of the foil surface. Therein the corresponding contactlayout can be produced from an originally full-area metallization forexample through etching or additive etching. The contact layout on theback side can in addition have the necessary components of a coil forthe additional contactless data exchange and/or the contactless energysupply the card (dual interface card).

The layered compound advantageously can consist only of the twoabove-mentioned layers. According to a preferred embodiment, however, anintermediate foil is arranged between the foil substrate and thereinforcement layer, so as to protect the flip chip in the final cardagainst mechanical loads. For this purpose the intermediate foil,according to a first variant, can have gaps in which the flip chips cometo lie. The depth of the gap preferably corresponds approximately to thethickness of the flip chip, i.e. it can also be slightly deeper, but inany case should not be shallower than the flip chip structure on thefoil substrate. The gaps of the intermediate foil can advantageously bepresent in the form of through openings in the intermediate foil, whichcan be produced cost-effectively for example through punching out.

According to a second variant for the protection of the flip chips amaterial can be chosen for the intermediate foil which is softer thanthe materials of the foil substrate and a reinforcement foil bondedthereto. The flip chips can be embedded in such an intermediate foilmaterial when the foil layers are bonded to form the layered compound.As material for the intermediate foil a correspondingly flexible andplastically deformable material lends itself, in particular a foammaterial.

In the case that an intermediate foil is provided the foil compoundpreferably consists only of the three mentioned layers so as to keep theproduction expense low, but if required it can also consist of more thanonly three foil layers.

When bonding the foil layers to form a foil compound adhesives can beused. In the case of thermoplastic foil layers the use of adhesives canbe omitted. It is advantageous in any case, however, to carry out thelaminating of the foil layers to form a foil compound applying increasedpressure and increased temperature, in particular when thermoplasticfoil layers are bonded to each other without using an adhesive.

Instead of making the reinforcement layer available as a foil, accordingto another embodiment of the invention it can be produced alternativelyas an injection-molded layer by back injection molding of the foilsubstrate—or, if applicable, of the intermediate foil.

The thickness of the layered compound is preferably chosen in such afashion that it corresponds to the ISO standard thickness of ID-1 chipcards or corresponding plug-in SIMs. However, they can also havedifferent dimensions, for example have the form of USB tokens. As USBtoken the exterior contact areas are configured for communication withUSB interfaces, and the dimensions of the chip card are chosen such thatthe card can be plugged with its USB interface into a USB connector.Here the ISO standard thickness can in particular be exceeded.

The chip cards can be personalized and/or printed in a further methodstep, with this method step for cost reasons preferably taking placebefore the severing of the chip cards from the layered compound.

DESCRIPTION OF THE DRAWINGS

The invention will hereinafter be described by way of example withreference to the accompanying drawings. The figures are described asfollows:

FIG. 1 a chip card in the ID-1 format schematically in a plan view,

FIG. 2 the layer structure of the chip card of FIG. 1 schematically incross section,

FIG. 3 an alternative layer structure of the chip card of FIG. 1 incross section,

FIG. 4 a further alternative structure of the chip card of FIG. 1schematically in cross section,

FIG. 5 the steps for producing the chip card of FIG. 1 schematically ina roll-to-roll process,

FIG. 6 a chip card in the format of a USB token,

FIG. 7 a further alternative layer structure of the chip card of FIG. 1schematically in cross section and

FIG. 8 a strip-shaped layered compound in accordance with FIG. 7 in aplan view, from which several chip cards have already been severed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION

FIG. 1 shows schematically in a plan view a chip card 1 in the ID-1format with an exterior contact layout 2 for the contact-typecommunication with and/or energy supply through external data processingdevices, such as for example payment terminals, access control devices,computers and the like. The chip card 1 here is configured as a dualinterface card and correspondingly has a coil 3 integrated in the chipcard for contactless data- and/or energy transmission, said coil beingrepresented in FIG. 1 by dashed lines. The chip card 1 of FIG. 1 insteadof an ID-1 chip card can also have other form factors, for example thoseof a plug-in SIM, but then as a rule without the coil 3.

FIGS. 2 to 4 show the chip card of FIG. 1 according to three embodimentsschematically in cross section. In the first embodiment according toFIG. 2 the chip card 1 is realized as a two-layer layered compound 12and comprises as first layer a foil substrate 3 and as second layer areinforcement foil 5. On the front side 4 a of the foil substrate 4there is provided the communication contact layout 2 for contact-typecommunication, having the form of an etched metallization. On the backside 4 b of the foil substrate 4 a second or flip chip contact layout 6is disposed, on which a flip chip 7 is mounted in conventional flip chiptechnology. The connectors of the flip chip 7, which are not representedhere in detail, are connected electroconductively through the flip chipcontact layout 6 and furthermore through vias 8 penetrating the foilsubstrate 4 with the communication contact layout 2 disposed on thefront side of the foil substrate 4 a. Also the flip chip contact layout6 is realized e.g. as an etched metallization. Simultaneously with theproduction of the flip chip contact layout 6 the turns 3 a of the coil 3(by the exception of the “bridge” spanning the turns of the coil) wereproduced, thus equally preferably as an etched metallization.

The foil layers 4, 5 have a total thickness D corresponding to thethickness of the finished card. The bonding of the two foil layers 4, 5to the finished layered compound or material 12 with the total thicknessD takes place applying increased pressure and increased temperature. Inthe case that as materials for the two foil layers 4, 5 suitablethermoplastics are used, in this fashion a firm bond of the two layerscan be achieved without using an additional adhesive. In the case thatincompatible thermoplastics and/or a thermosetting plastic is/are usedfor the one and/or the other foil layer it is expedient to use anadhesive, however. In particular in the case of a thermo-activatableadhesive also here the use of increased pressure and increasedtemperature is sensible.

The second embodiment according to FIG. 3 differs from the embodiment ofFIG. 2 only in that the layered compound 12 has as third foil layer anintermediate foil 9 between the foil substrate 4 and the reinforcementfoil 5. The intermediate foil 9 has a gap 10 in which the flip chip 7 isaccommodated for protection against mechanical loads. The intermediatefoil 9 with the gap 10 can be omitted if the flip chip 7 is very thinand flexible, as is the case with the embodiment according to FIG. 2. Itis also conceivable in the embodiment in accordance with FIG. 2 toprovide a gap in the reinforcement foil 5 for accommodating the flipchip 7. This accommodation would then correspondingly have the depth ofthe thickness of the flip chip 7 or of the flip-chip structure, orslightly above. However, since providing such gaps is elaborate andcorrespondingly expensive, the use of the intermediate foil 9 in thecase of thicker and/or more inflexible flip chips 7 is advantageous,since the gap 10 in this case can be produced as a through opening,simply for example in a punching step. Since the depth of the gapcorresponds merely to the thickness of the flip chip 7 or of the flipchip structure, or slightly above, the intermediate foil 9 can be chosenwith a correspondingly small thickness.

The third embodiment in accordance with FIG. 4 shows a different variantfor the protection of a comparatively thick and/or inflexible flip chip7 against mechanical loads. Again there is provided an intermediate foil9 between the foil substrate 4 and the reinforcement foil 5. In thiscase the intermediate foil 9, however, does not have a gap, but consistsof a material which is softer than the materials of the foil substrate 4and the reinforcement foil 5. This is valid at least for the time ofbonding of the three foil layers to form the three-layer layeredcompound 12. Thus the intermediate foil 9 can for example have a lowersoftening point than the foil substrate 4 and the reinforcement foil 5,so that when the layers are laminated in increased temperature it issubstantially softer than the foil layers of the foil substrate 4 andthe reinforcement foil 5. In this fashion the flip chip 7 can beembedded in the intermediate foil 9.

The intermediate foil 9 can in particular also consist of a foammaterial, which is hot or cold bonded to the other two foil layers 4, 5.The section of the flip chip 7 can be kept free of adhesive duringadhesive bonding, so that there is no fixed bonding between the flipchip 7 and the intermediate layer 9. Thereby the flip chip 7 ismechanically decoupled from the intermediate layer 9.

FIG. 5 shows by way of example the production of the chip cards 1 in aroll-to-roll method. In a corresponding fashion the chip cards 1 canalso be produced from foil layers made available in the form of sheets.

The method starts with providing a foil substrate 4, on which at leastthe communication contact layout 2 and the flip chip contact layout 6are present and are electroconductively connected with each other bymeans of the vias 8 (FIG. 2). As far as not already present, firstlyflip chips 2 are mounted on the flip chip contact layouts 6.Subsequently the foil substrate 4 is joined with the reinforcement foil5 and—in this case—the intermediate foil 9. Before the joining in afirst punching station 11 gaps 10 are punched out from the intermediatefoil 9, in which subsequently the flip chips 7 come to lie. The foillayers 4, 5, 9 are subsequently laminated using increased pressure p andincreased temperature T to form a layered compound 12. From the layeredcompound 12 in a second punching station 13 the chip cards 1 are thenpunched out. The rest of the foil compound 12 is wound onto a wastereel. The chip cards 1 can be personalized and/or printed before thesevering in a corresponding station not represented here, e.g. throughlaser inscription.

FIG. 6 shows a chip card 1 in the form of a USB token. The contactlayout 2 for the contact-type communication with and current supplythrough an external device comprises the two protruding outer pins 14,15 for the supply voltage and the shorter pins 16, 17 for the datatraffic.

FIG. 7 shows schematically in cross section a further embodiment for alayer structure 12, which differs from the embodiments according toFIGS. 2 to 4 essentially in that instead of the reinforcement foil 5there is provided an injection-molded layer 5′ as reinforcement layer,so as to form the layered compound 12. An intermediate foil 9 with gaps10 for accommodating the flip chips 7 as described with reference toFIG. 3 can be provided additionally. The bonding of the injection-moldedlayer 5′ with the foil substrate 4—or alternatively with theintermediate layer 9—can be realized in a simple fashion in that thefoil substrate 4 is back injection molded with the injection moldingmaterial of the injection molding layer 5′. For this purpose either thecomplete foil substrate 4 with the flip chips 7 mounted on it can beback injection molded. However, alternatively the foil substrate 4 canalso be cut into strips and then be back injection molded with theinjection molding layer 5′. Such a strip is shown in FIG. 8. From thestrip-shaped layered compound 12 the chip cards 1 are then severed, forexample punched out, and there remain corresponding holes 18 in thelayered compound 12.

1-33. (canceled)
 34. A method for producing chip cards, comprising thesteps: providing a foil substrate with a front side and a back side,with several communication contact layouts for contact-typecommunication of the chip cards to be produced with externalcommunication devices on the front side and several flip chip contactlayouts for connecting respectively at least one flip chip on the backside, and wherein the several flip chip contact layouts areelectroconductively connected with respectively one of the severalcommunication contact layouts; if the several flip chip contact layoutsare not already equipped with flip chips, mounting flip chips onto theflip chip contact layouts; providing a reinforcement layer; bonding thefoil substrate fitted with the at least one flip chip with thereinforcement layer to form a layered material; and severing individualchip cards with chip-card end product dimensions from the layeredmaterial.
 35. The method according to claim 34, wherein the foilsubstrate is provided with coils provided on the back side which are incontact or are brought into contact with the flip chips or flip chipcontact layouts or providing such a coil on the back side of the foilsubstrate.
 36. The method according to claim 34, wherein thereinforcement layer comprises a reinforcement foil.
 37. The methodaccording to claim 36, wherein the layered material includes only saidtwo foil layers.
 38. The method in accordance with claim 36, includingthe further steps of providing an intermediate foil and arranging theintermediate foil between the foil substrate and the reinforcement foilbefore the step of bonding to form the layered material.
 39. The methodaccording to claim 38, wherein the intermediate foil includes gapsaccommodating the flip chips and is arranged between the foil substrateand the reinforcement foil so that a respective flip chip is disposed inthe gap.
 40. The method according to claim 39, wherein a depth of thegaps of the intermediate foil is chosen such that it corresponds to thethickness of a respective flip chip.
 41. The method according to claim39, wherein the intermediate foil is configured so that the gaps aredefined by through openings in the intermediate foil.
 42. The methodaccording to claim 38, wherein the intermediate foil comprises amaterial which is softer than the materials of the foil substrate and ofthe reinforcement foil, and wherein, in the step of bonding to form thelayered material, the flip chips are embedded in the intermediate foil.43. The method according to claim 42, wherein the material of theintermediate foil comprises a foam material.
 44. The method according toclaim 38, wherein the foil material comprises only the three foillayers.
 45. The method according to claim 34, wherein the reinforcementlayer comprises injection molded material, which is bonded to the foilsubstrate by back injection molding of the foil substrate.
 46. Themethod according to claim 34, wherein the step of bonding to form alayered material comprises application of pressure and temperature. 47.The method according to claim 34, wherein the thickness of the layeredcompound is selected so that it corresponds to the ISO thickness of ID-1chip cards.
 48. The method according to claim 34, wherein the chip-cardfinal product dimensions correspond to the dimensions of plug-in SIMs orID-1 chip cards.
 49. The method according to claim 34, wherein the chipcards are severed from the layered material in the form of USB tokens.50. The method according to claim 34, including the step ofpersonalizing the chip cards.
 51. The method according to claim 50,wherein the step of personalizing the chip cards takes place before thestep of severing of the chip cards from the layered material.
 52. Themethod according to claim 34, wherein the foil substrate comprises sheetmaterial or roll material.
 53. A chip card, comprising a layeredmaterial comprising two layers extending over the complete chip card, ofwhich a first layer is configured as a foil layer having an outwardfacing front side and an inward facing back side, wherein there isapplied on the front side a communication contact layout forcontact-type communication of the chip card with external communicationdevices, and which is electroconductively connected with a flip chipcontact layout on the back side, on which back side there is mounted aflip chip.
 54. The chip card according to claim 53, wherein at least thecommunication contact layouts on the front side of the first layercomprise metallization of the first layer.
 55. The chip card accordingto claim 53, wherein on the back side of the first layer there isprovided a coil which is in contact with the flip chip contact layout orwith the flip chip.
 56. The chip card according to claim 53, wherein thesecond layer is also configured as a foil layer.
 57. The chip cardaccording to claim 53, wherein the layered material comprises twolayers,
 58. The chip card according to claim 53, including anintermediate foil lying between the first layer and the second layer.59. The chip card according to claim 58, wherein the intermediate foilincludes a gap in which the flip chip is disposed.
 60. The chip cardaccording to claim 59, wherein the gap has a depth which corresponds tothe thickness of the flip chip.
 61. The chip card according to claim 59,wherein the gap is configured as a through opening in the intermediatefoil.
 62. The chip card according to claim 58, wherein the flip chip isembedded in the intermediate foil.
 63. The chip card according to claim58, wherein the layered material comprises three layers.
 64. The chipcard according to claim 53, wherein the second layer comprises aninjection-molded layer.
 65. The chip card according to claim 53, whereinthe chip card has the dimensions of a plug-in SIM or an ID-1 chip card.66. The chip card according to claim 53, wherein the chip card isconfigured as a USB token.